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What is it?
Spherical Quartz Powder
?
After purification and ultrafine milling, sphere quartz powder is made out of natural quartz stones. Amorphous powder is made from irregularly angular materials into regular spherical ones.
The key features of Spherical Quartz Powder
Spherical quartz powder offers the benefits of a smooth surface and large specific area. It also has high chemical stability. First, the spherical material is very fluid. The resin is mixed evenly with it to form a film. The greater the amount of quartz powder used to fill the mold, the lower its thermal conductivity. Also, the molding compound’s thermal expansion coefficient will be smaller. Additionally, single crystal silicon has a higher thermal expansion coefficient. This will improve the performance of electronic components. Second, the stress in spherical powder is less than half that in angular powder. Furthermore, the molding compound made with spherical Quartz powder has the lowest stress concentrations and highest strength. Finally, the surface of spherical quartz powder is smooth. The friction coefficient is low and the wear on molds is minimal. This can help extend the mold’s life expectancy by more than one-third.
Spherical Quartz powder’s uses
Spherical quartz powder can be used in many different applications. Electronic packaging is one of the most popular uses. Electronic packaging is an industry that supports integrated circuits. As integrated circuits become more sophisticated, the requirements for packaging materials are rising. Packaging forms are continually optimized and up-dated to meet these new requirements. The main materials for electronic packaging include substrate material, plastic packing material, lead frame, and solder. Plastic packaging is a low-cost and easy-to-make product that can be mass produced in large quantities. This has helped it grow rapidly. Plastic packaging is responsible for 95% worldwide integrated circuit market. %above. EMC is the main plastic encapsulant. It houses more than 95% microelectronic component.
1. Microelectronic packaging must be able to withstand high levels of moisture, stress, low stress, low alpha-ray, dip and reflow soldering, as well as good plastic sealing properties. To address this issue, epoxy molding compounds must be doped in the resin matrix with inorganic materials. The majority of inorganic materials currently used are quartz micropowder, or silicon micropowder. Large-scale and ultra-large scale integrated circuits now have more stringent requirements for packaging materials due to their rapid growth. Quartz powder, an important support material for EMC requires that its particle size be within the required packaging range. Additionally, it must be pure. High and low radioactive elements are essential for particle shape. Spheroidization requirements apply to quartz powder.
2. Spherical silicon nanopowder has a great shape and can also meet many technical requirements for high-end integrated circuits. It can reduce the thermal expansion coefficient, stress and dielectric constant of plastic sealing materials. It can also greatly increase the rigidity, wear resistance. Weather resistance, impact resistance. Tensile resistance. UV radiation resistance. Aside from being used in electronic packaging, spherical Quartz powder can be widely used in the manufacturing of electronic inks and optical fibres, high-end cosmetics as well as precision grinding of electronic devices and components.
The principal supplier of Spherical Quartz Powder
Tech Co., Ltd. () is a professional oxide powder Over 12 years’ experience in chemical products development and research. We accept credit cards, T/T and West Union payments. We will ship goods overseas via FedEx, DHL and by air or sea to our customers.
You can find high-quality powdered boron carbide here Please contact us Send an inquiry
The key features of Spherical Quartz Powder
Spherical quartz powder offers the benefits of a smooth surface and large specific area. It also has high chemical stability. First, the spherical material is very fluid. The resin is mixed evenly with it to form a film. The greater the amount of quartz powder used to fill the mold, the lower its thermal conductivity. Also, the molding compound’s thermal expansion coefficient will be smaller. Additionally, single crystal silicon has a higher thermal expansion coefficient. This will improve the performance of electronic components. Second, the stress in spherical powder is less than half that in angular powder. Furthermore, the molding compound made with spherical Quartz powder has the lowest stress concentrations and highest strength. Finally, the surface of spherical quartz powder is smooth. The friction coefficient is low and the wear on molds is minimal. This can help extend the mold’s life expectancy by more than one-third.
| Spherical Quartz Powder Spherical SiO2 Properties | |
| Other Titles | Fused quartz, spherial quartz, spherical SiO2, silica |
| No. | 7631-86-9 |
| Combination Formula | SiO2 |
| Molecular Weight | 60.09 |
| Appearance | Powder White |
| Melting Point | 1,600deg C (2,912deg F) |
| Solubility of in water | N/A |
| Density | 2533 kg/m3 |
| Purity | 99.5-99.9% |
| Particle size | 10-30nm |
| Boling Point | 2,230deg C (4,046deg F) |
| Specific heat | N/A |
| Thermal Conductivity | N/A |
| Thermal Expansion | N/A |
| Young’s Modulus | N/A |
| Exact | 59.9668 g/mol |
| Monoisotopic | 59.967 D |
Spherical Quartz Powder Spherical SiO2
Spherical quartz powder can be used in many different applications. Electronic packaging is one of the most popular uses. Electronic packaging is an industry that supports integrated circuits. As integrated circuits become more sophisticated, the requirements for packaging materials are rising. Packaging forms are continually optimized and up-dated to meet these new requirements. The main materials for electronic packaging include substrate material, plastic packing material, lead frame, and solder. Plastic packaging is a low-cost and easy-to-make product that can be mass produced in large quantities. This has helped it grow rapidly. Plastic packaging is responsible for 95% worldwide integrated circuit market. %above. EMC is the main plastic encapsulant. It houses more than 95% microelectronic component.
1. Microelectronic packaging must be able to withstand high levels of moisture, stress, low stress, low alpha-ray, dip and reflow soldering, as well as good plastic sealing properties. To address this issue, epoxy molding compounds must be doped in the resin matrix with inorganic materials. The majority of inorganic materials currently used are quartz micropowder, or silicon micropowder. Large-scale and ultra-large scale integrated circuits now have more stringent requirements for packaging materials due to their rapid growth. Quartz powder, an important support material for EMC requires that its particle size be within the required packaging range. Additionally, it must be pure. High and low radioactive elements are essential for particle shape. Spheroidization requirements apply to quartz powder.
2. Spherical silicon nanopowder has a great shape and can also meet many technical requirements for high-end integrated circuits. It can reduce the thermal expansion coefficient, stress and dielectric constant of plastic sealing materials. It can also greatly increase the rigidity, wear resistance. Weather resistance, impact resistance. Tensile resistance. UV radiation resistance. Aside from being used in electronic packaging, spherical Quartz powder can be widely used in the manufacturing of electronic inks and optical fibres, high-end cosmetics as well as precision grinding of electronic devices and components.
The principal supplier of Spherical Quartz Powder
Tech Co., Ltd. () is a professional oxide powder Over 12 years’ experience in chemical products development and research. We accept credit cards, T/T and West Union payments. We will ship goods overseas via FedEx, DHL and by air or sea to our customers.
You can find high-quality powdered boron carbide here Please contact us Send an inquiry